| Customization: | Available |
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| Feature: | Photodegradable |
| CAS No.: | 25134-01-4 |
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MPPO Granules are high-performance engineering thermoplastics that are widely used in a variety of applications. This material is a modified version of polyphenylene oxide (PPO) which is reinforced with other high-performance polymers such as polyphenyleneether (PPE), allowing for even greater toughness and strength. MPPO Granules offer a range of advantages over regular PPO, such as superior chemical resistance, higher impact strength, and better dimensional stability.
This material is an excellent choice for applications that require both heat resistance and dimensional stability, such as
automotive parts, electrical housings, medical equipment, and industrial machinery. MPPO Granules are also commonly used in electronic components, as they have excellent electrical insulation properties, low dielectric constant, and low moisture absorption rate.
Based on the end-use requirements of the application fields, Dawn have developed weather-resistant MPPO, halogen-free
flame-retardant MPPO, GF reinforced MPPO, antistatic MPPO, flame-retardant reinforced MPPO, and so on. If you have any customized requirements, please contact us.
| Item | Results |
| Gravity | 1.02 g/m³ |
| Hydroxy Equivalent Weight (HEW) | 840 g/mol |
| Mn | 1600 |
| Phenolic End-group Content | 2 % |
| Tg (half width) | 140 °C |
| Intrinsic viscosity | |
| Solubility | |
| Methyl Ethyl Keton : 21°C | 50.0 wt% |
| Toluen : 21°C | 50.0 wt% |
| Viscosity | |
| 50 wt% in methyl ethyl keton : 25°C | 160 mPa s |
| 50 wt% in toluen : 25°C | 298 mPa s |
1.NORYL SA90 resin is a modified low molecular weight resin with increased hydroxyl functionality.
2.It is designed specifically for use as a reactive component in epoxy and cyanate ester thermosets in electronic, coatings, adhesives and composites applications.
3.It has outstanding solubility in toluen methyl ethyl keton (MEK) and a low solution viscosity.
4.Used to enhance the performance (e.g. thermal, dielectric, mechanical, flame retardancy, and moisture uptake properties) of epoxy resins used in electronic packaging which include PCB laminates, copper clad laminates, epoxy prepregs, and protective coatings as well as various other composites applications.
Modified Polyphenylene Ether Packaging and Shipping
Packing: 25kg/drum
Modified Polyphenylene Ether Storage
Stored in cool dry ventilated place away from fire, heat, light, acids and food materials
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